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NXP Semiconductors
Table 4.
Pin description for SO16 and TSSOP16
PCA9633
4-bit Fm+ I 2 C-bus LED driver
Symbol
A0
A1
LED0
LED1
LED2
LED3
A2
A3
V SS
OE
A4
SCL
SDA
A5
A6
V DD
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Type
I
I
O
O
O
O
I
I
power supply
I
I
I
I/O
I
I
power supply
Description
address input 0
address input 1
LED driver 0
LED driver 1
LED driver 2
LED driver 3
address input 2
address input 3
supply ground
active LOW Output Enable
address input 4
serial clock line
serial data line
address input 5
address input 6
supply voltage
Table 5.
Pin description for HVQFN16
Symbol
LED0
LED1
LED2
LED3
A2
A3
Pin
1
2
3
4
5
6
Type
O
O
O
O
I
I
Description
LED driver 0
LED driver 1
LED driver 2
LED driver 3
address input 2
address input 3
V SS
[1]
7
power supply
supply ground
OE
A4
SCL
SDA
A5
A6
V DD
A0
A1
8
9
10
11
12
13
14
15
16
I
I
I
I/O
I
I
power supply
I
I
active LOW Output Enable
address input 4
serial clock line
serial data line
address input 5
address input 6
supply voltage
address input 0
address input 1
PCA9633_5
[1]
HVQFN16 package die supply ground is connected to both the V SS pin and the exposed center pad. The
V SS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical,
and board-level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be
incorporated in the PCB in the thermal pad region.
? NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 July 2008
7 of 43
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